Etching Solution with Suspended Copper Catalyst
Original Publication Date: 1980-Oct-01
Included in the Prior Art Database: 2005-Feb-13
In some configurations of metallized ceramic substrates on which silicon chips are mounted a thin layer of cermet material is employed to form resistors. In a typical process a cermet layer 12 is applied to the ceramic substrate 10, and this is followed by the application of other layers of material such as Cr-Cu-Cr metallization for forming conductors, and photoresist for allowing the selective removal of the Cr-Cu-Cr to form the desired surface wiring.