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Etching Solution with Suspended Copper Catalyst

IP.com Disclosure Number: IPCOM000055971D
Original Publication Date: 1980-Oct-01
Included in the Prior Art Database: 2005-Feb-13

Publishing Venue

IBM

Related People

Authors:
Case, G Hoffman, HS Starr, S [+details]

Abstract

In some configurations of metallized ceramic substrates on which silicon chips are mounted a thin layer of cermet material is employed to form resistors. In a typical process a cermet layer 12 is applied to the ceramic substrate 10, and this is followed by the application of other layers of material such as Cr-Cu-Cr metallization for forming conductors, and photoresist for allowing the selective removal of the Cr-Cu-Cr to form the desired surface wiring.