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MLC Top Surface Metallurgy with Cr/SiO Resistors

IP.com Disclosure Number: IPCOM000055974D
Original Publication Date: 1980-Oct-01
Included in the Prior Art Database: 2005-Feb-13

Publishing Venue

IBM

Related People

Authors:
Gow, J Hoffman, HS [+details]

Abstract

It is becoming common practice in the components packaging art to form multilayered ceramic modules. In certain configurations each of the layers contains metal lines, with the top layer or surface often containing cermet resistors, such as shown in the figure. The various layers of metal need to be interconnected, this interconnection being through vias having disposed therein refractory metal, such as glass frit filled with W or Mo.