Browse Prior Art Database

Immersion Solder Wave Sealing System

IP.com Disclosure Number: IPCOM000055981D
Original Publication Date: 1980-Oct-01
Included in the Prior Art Database: 2005-Feb-13

Publishing Venue

IBM

Related People

Authors:
Kohn, H Krzyzewski, AS Senger, RC [+details]

Abstract

In present day technology, it is desirable that printed circuit boards be soldered while immersed in a heated flux, and this necessitates the generation of a solder wave immersed in the flux without permitting any flux to escape the system.