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Immersion Solder Wave Sealing System Disclosure Number: IPCOM000055981D
Original Publication Date: 1980-Oct-01
Included in the Prior Art Database: 2005-Feb-13

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Kohn, H Krzyzewski, AS Senger, RC [+details]


In present day technology, it is desirable that printed circuit boards be soldered while immersed in a heated flux, and this necessitates the generation of a solder wave immersed in the flux without permitting any flux to escape the system.