High Resistance Shield for Magnetic Domain Package
Original Publication Date: 1980-Oct-01
Included in the Prior Art Database: 2005-Feb-13
It is customary to use a copper foil conductive material such as KAPTON* copper in an electrostatic shield for magnetic domain packages such as the one described in the IBM Technical Disclosure Bulletin 22, 8A 3175 (January 1980). However, if the copper foil shield is contiguous, large eddy currents are induced in the shield, with a concomitant increase in power and thermal effects which are detrimental to the operation of the domain (i.e., bubble) chips and/or associated bias field magnets. To minimize the eddy current effects, the shield of the aforementioned publication is provided with T-shaped openings.