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Metal lines 1 are formed on a bare silicon substrate 2 (Fig. 1). The width of the line 1 corresponds to the eventual capillary/nozzle width, and the metal height to the height of the capillary/nozzle.
English (United States)
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Fabricating Capillaries and Nozzles for Ink Jet Printing
Metal lines 1 are formed on a bare silicon substrate 2 (Fig. 1). The width of
the line 1 corresponds to the eventual capillary/nozzle width, and the metal
height to the height of the capillary/nozzle.
The fabrication technique of defining the metallization can be either sub-etch
or lift-off depending on the ground rules one desires to achieve. A metallurgy
such as Al or Al/Cu is ideal both from a definition standpoint (forming the lines)
and a capillary/nozzle standpoint.
The structure is now overcoated with a film 3, such as sputtered quartz or
silicon (Fig. 2).
Depending on the desired ground rules, planarized sputtered quartz can be
used or a planarizing technique can be used to level the structure.
Via holes 4 (Figs. 3 and 4) are now defined through the SiO(2), Si, etc., to the
already formed metal lands 1 and thus the Si substrate 2.
A second layer of metal 5 is now formed, in a like manner to the first (Figs. 3
Fig. 3 shows the metal lines interconnected for simplicity only, as each could
be made individually accessible.
The structure is once again overcoated, as before.
Additional layers of metal and overcoating can be applied in a similar manner
utilizing any of several well-known planarization techniques.
Once the entire structure is formed, comprising alternate layers of metal
separated by overcoat and all connected by via holes to the silicon substrate, the
structure is sintered at a temp...