Anti Turbulent Vent (Vacuum) Device
Original Publication Date: 1980-Oct-01
Included in the Prior Art Database: 2005-Feb-13
Manufacture of semiconductor devices includes the deposition of metal and insulator materials on the master wafers during processing. These wafers, with their circuitry, are placed in process chambers, such as evaporators and sputterers, where the required deposition is achieved under a vacuum. During processing, material is deposited throughout the chamber as well as on the wafers. Deposition other than on the wafers is not on an optimum surface, is of a repetitive build-up, and consequently tends to adhere loosely in given areas.