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Chip Protective Coating Disclosure Number: IPCOM000055999D
Original Publication Date: 1980-Oct-01
Included in the Prior Art Database: 2005-Feb-13

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Related People

Martin, BD Moakler, EJ Nagy, MF Schiller, JM Zalar, SM [+details]


Chip or wafer 1 with solder balls 2 is coated with polyimide layer 3 by spray, dispense or brush techniques to provide a controlled volume of polyimide solution such that when cured, the polyimide layer 3 coats the active surface of chip 1 while, by capillarity, the polyimide coats each solder ball (Fig. 1).