Chip Protective Coating
Original Publication Date: 1980-Oct-01
Included in the Prior Art Database: 2005-Feb-13
Chip or wafer 1 with solder balls 2 is coated with polyimide layer 3 by spray, dispense or brush techniques to provide a controlled volume of polyimide solution such that when cured, the polyimide layer 3 coats the active surface of chip 1 while, by capillarity, the polyimide coats each solder ball (Fig. 1).