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In this process metal studs are formed on a multilayer ceramic substrate using conventional multilayer ceramic technology, which can be conveniently soldered to a board or other support.
English (United States)
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Method of Joining Multilayer Ceramic Substrates to Printed Circuit
In this process metal studs are formed on a multilayer ceramic substrate
using conventional multilayer ceramic technology, which can be conveniently
soldered to a board or other support.
In carrying out this joining process, the multilayer joining substrate 10 is
formed in the conventional way by doctor blading a suitable ceramic slurry,
punching via holes, screening conductive refractory metal into the via holes and
forming conductive lines on the respective sheets, and, finally, assembling and
laminating the sheets. A top sheet 12 is formed by doctor blading a slurry formed
of particles of material which are stable at a laminating temperature,
approximately 95 degrees C, but which volatizes or decomposes into a volatile
compound without leaving a residue at or below the firing temperatures of the
ceramic module. Such a slurry can be formed of terephthalic acid particles
mixed with a suitable binder, such as polyvinyl butyral and dioctyl phthalate in
methanol. Sheet 12 is cast in the conventional way, and dried to form a flexible
green sheet. Via holes are punched in green sheet 12 in the pattern required for
I/O connections. One or more of the sheets are laminated to the top surface of
substrate 10, as illustrated in Fig. 1. The via holes in sheet 12 are filled with a
suitable conductive paste of a refractory material or the like by screen printing or
a similar method before or after the sheet i...