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Method of Joining Multilayer Ceramic Substrates to Printed Circuit

IP.com Disclosure Number: IPCOM000056005D
Original Publication Date: 1980-Oct-01
Included in the Prior Art Database: 2005-Feb-13

Publishing Venue

IBM

Related People

Authors:
Rogers, CT Schmeckenbecher, A [+details]

Abstract

In this process metal studs are formed on a multilayer ceramic substrate using conventional multilayer ceramic technology, which can be conveniently soldered to a board or other support.