Browse Prior Art Database

Method of Joining Multilayer Ceramic Substrates to Printed Circuit Disclosure Number: IPCOM000056005D
Original Publication Date: 1980-Oct-01
Included in the Prior Art Database: 2005-Feb-13

Publishing Venue


Related People

Rogers, CT Schmeckenbecher, A [+details]


In this process metal studs are formed on a multilayer ceramic substrate using conventional multilayer ceramic technology, which can be conveniently soldered to a board or other support.