Browse Prior Art Database

Low Resistance Solder Via Pad Structure

IP.com Disclosure Number: IPCOM000056007D
Original Publication Date: 1980-Oct-01
Included in the Prior Art Database: 2005-Feb-13

Publishing Venue

IBM

Related People

Authors:
Grosewald, PS Reeber, MD [+details]

Abstract

In this pad structure, increase of the resistance in the via opening due to high resistivity intermetallic, which may form as a result of the solder reaction with the pad, is minimized or eliminated.