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Low Resistance Solder Via Pad Structure Disclosure Number: IPCOM000056007D
Original Publication Date: 1980-Oct-01
Included in the Prior Art Database: 2005-Feb-13

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Grosewald, PS Reeber, MD [+details]


In this pad structure, increase of the resistance in the via opening due to high resistivity intermetallic, which may form as a result of the solder reaction with the pad, is minimized or eliminated.