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Semiconductor Chip Cooling System

IP.com Disclosure Number: IPCOM000056046D
Original Publication Date: 1980-Oct-01
Included in the Prior Art Database: 2005-Feb-13

Publishing Venue

IBM

Related People

Authors:
Krumm, H Schettler, H Stahl, R Zuehlke, R [+details]

Abstract

Chips 1 are soldered to ceramic substrate 3, forming a module therewith The modules which are soldered to cards 3 plugged into boards are cooled by means of an airflow. Sectional and plan views of a corresponding arrangement are shown in Figs. 1 and 2, respectively.