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Improving Bondability of Wire in an Ultrasonic Bonding Process

IP.com Disclosure Number: IPCOM000056061D
Original Publication Date: 1980-Oct-01
Included in the Prior Art Database: 2005-Feb-13

Publishing Venue

IBM

Related People

Authors:
Finch, WF [+details]

Abstract

Bondability of gold-plated wire to a substrate will often be poor if the gold concentration in the plating bath is too low or if the plating current density is too high. This is because each of these conditions can lead to trapped organics which spoil the malleability of the gold plating.