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Process for Fabricating Membrane Nozzles

IP.com Disclosure Number: IPCOM000056109D
Original Publication Date: 1980-Oct-01
Included in the Prior Art Database: 2005-Feb-13

Publishing Venue

IBM

Related People

Authors:
Baran, E Bogardus, EH Lane, R [+details]

Abstract

Present membrane nozzle technology utilizes anisotropically etched silicon with either a thermal oxide or deposited SiC membrane. Performance of the Si-SiO(2) nozzles is excellent. However, the corrosion of these nozzles in the presence of the presently used ink is intolerable.