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Flip-Chip Bonding by Solder Filling of Capillaries Disclosure Number: IPCOM000056113D
Original Publication Date: 1980-Oct-01
Included in the Prior Art Database: 2005-Feb-13

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Comerford, LD [+details]


Smooth walled metal-coated channels (up to several mils wide) may be preferentially filled with a solder, such as indium, in order to bond a chip to a substrate. The solder-filled channels may simultaneously serve as electrical leads.