Browse Prior Art Database

Flip-Chip Bonding by Solder Filling of Capillaries

IP.com Disclosure Number: IPCOM000056113D
Original Publication Date: 1980-Oct-01
Included in the Prior Art Database: 2005-Feb-13

Publishing Venue

IBM

Related People

Authors:
Comerford, LD [+details]

Abstract

Smooth walled metal-coated channels (up to several mils wide) may be preferentially filled with a solder, such as indium, in order to bond a chip to a substrate. The solder-filled channels may simultaneously serve as electrical leads.