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Structure for Achieving Thermal Enhancement in a Semiconductor Package

IP.com Disclosure Number: IPCOM000056192D
Original Publication Date: 1980-Nov-01
Included in the Prior Art Database: 2005-Feb-14

Publishing Venue

IBM

Related People

Authors:
Miller, RC [+details]

Abstract

This technique for improving thermal enhancement reduces the stress applied to the semiconductor, improves thermal conductivity between the device and the cap or heat sink, and reduces the cost.