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An improved method for making a silicon membrane ink jet nozzle is described.
English (United States)
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Reactive Plasma Deposited Silicon Membrane Nozzle
An improved method for making a silicon membrane ink jet nozzle is
The method comprises the deposition of a glow-discharge silicon carbon
membrane 10 on substrate 12, which creates a composition gradient throughout
the thickness of the membrane member 10. The composition gradient through
membrane 10 varies from a lower silicon content on top surface 14 of about 20
atomic percent and increasing through the thickness of membrane 10 so that at
the bottom surface 16, the silicon content is about 40 atomic percent.
With this membrane composition, mask 18 can be used in a plasma etching
process to produce opening 20 in membrane 10. Due to the composition
difference, slower lateral etching takes place at the top of the membrane 10 and
a progressively faster lateral etching rate occurs as you move to the bottom
surface 16 which is richer in silicon. The result is an opening 20 having smooth
vertical walls. The mask 18 is then removed and aperture opening 22 is then
etched in substrate 12 in conventional fashion to produce an ink jet nozzle.
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