Potting Technique to Prevent Thermal Influences from Affecting a Magnetic Bias Field in a Magnetic Bubble Memory Module
Original Publication Date: 1980-Nov-01
Included in the Prior Art Database: 2005-Feb-14
A magnetic bubble domain module 10, as shown in the drawing, contains a non-rigid potting compound 12 that is positioned between the magnetic shield 16 and the bias structure 18. Coils 20 and the bubble chip 11 are inside the bias structure 18. A rigid potting compound 22 is positioned about the substrate 24 and the input/output pins 26. The use of the non-rigid potting compound 12 prevents degradation of the magnetic field.