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Potting Technique to Prevent Thermal Influences from Affecting a Magnetic Bias Field in a Magnetic Bubble Memory Module

IP.com Disclosure Number: IPCOM000056290D
Original Publication Date: 1980-Nov-01
Included in the Prior Art Database: 2005-Feb-14

Publishing Venue

IBM

Related People

Authors:
Burry, JM Hansen, RL Mathers, MR [+details]

Abstract

A magnetic bubble domain module 10, as shown in the drawing, contains a non-rigid potting compound 12 that is positioned between the magnetic shield 16 and the bias structure 18. Coils 20 and the bubble chip 11 are inside the bias structure 18. A rigid potting compound 22 is positioned about the substrate 24 and the input/output pins 26. The use of the non-rigid potting compound 12 prevents degradation of the magnetic field.