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Destacking Method

IP.com Disclosure Number: IPCOM000056379D
Original Publication Date: 1980-Dec-01
Included in the Prior Art Database: 2005-Feb-14

Publishing Venue

IBM

Related People

Authors:
Holsopple, J Sommer, GC [+details]

Abstract

In many cases it is necessary to separate stacked chip modules in order to rework certain components. These stacked modules are comprised of a plurality of substrates with chips mounted on at least one substrate. The modules are interconnected by solder connections.