Browse Prior Art Database

Destacking Method Disclosure Number: IPCOM000056379D
Original Publication Date: 1980-Dec-01
Included in the Prior Art Database: 2005-Feb-14

Publishing Venue


Related People

Holsopple, J Sommer, GC [+details]


In many cases it is necessary to separate stacked chip modules in order to rework certain components. These stacked modules are comprised of a plurality of substrates with chips mounted on at least one substrate. The modules are interconnected by solder connections.