Silicon Chip Crossovers Extend Wirability of Metallized Ceramic Modules
Original Publication Date: 1980-Dec-01
Included in the Prior Art Database: 2005-Feb-14
Metallized ceramic carriers have long been used for semiconductor chips, but the number of transistors and diodes per chip have now increased from a very few to many tens of thousands, causing the number of connections and wiring leads required to significantly increase. Present carriers generally have a single wiring level for reasons of cost, manufacturability and reliability. This single wiring level prevents crossover of leads on the carrier and severely limits wirability. A method of having the leads crossover one another without using more costly, lower yield multilevel wiring technologies for modules is thus desired.