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Semiconductor Polishing Composition

IP.com Disclosure Number: IPCOM000056395D
Original Publication Date: 1980-Dec-01
Included in the Prior Art Database: 2005-Feb-14

Publishing Venue

IBM

Related People

Authors:
Holley, B Kaplan, P Mendel, E [+details]

Abstract

A polishing slurry composition for polishing semiconductor wafers includes an aqueous colloid of silica, a metal carbonate, sodium hypochlorite and an alkali metal hydroxide to adjust the pH to about 11.0 to 12.0. Useful slurry compositions would include, for example: Na(2)CO(3) H(2)O 6.8 - 13.5 gm/1. of slurry NaOCl (5.75%) 35 - 50 ml./1. of slurry SiO(2) (colloidal) 8 - 10% by weight NaOH or KOH to adjust the pH of the slurry to 11.0 to 12.0.