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Thin Film Deposition Apparatus for Double Sided Metallurgy

IP.com Disclosure Number: IPCOM000056403D
Original Publication Date: 1980-Dec-01
Included in the Prior Art Database: 2005-Feb-14

Publishing Venue

IBM

Related People

Authors:
Christensen, RG Oldakowski, CC [+details]

Abstract

Thin film deposition apparatus is provided for depositing on both sides of a substrate in a single pumpdown with higher throughput, more uniformity and less shadowing being achieved. The apparatus utilizes an overall cylindrical frame configuration within a chamber, with the frame configuration acting to position multiple substrate holders around its periphery to follow a circumferential path circumscribing source means. The substrate holders, in following one major circumferential path of revolution, act to rotate each individual substrate holder one revolution.