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Described here in packaging of multichip modules (MCMS) without the need of multilayer ceramic (MLC) technology.
English (United States)
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Flip Chip on Personalization Chip Carrier Package
Described here in packaging of multichip modules (MCMS) without the need
of multilayer ceramic (MLC) technology.
The concept here consists of packaging multiple LSI chips on a ceramic
substrate module. The process comprehends the joining of predicted LSI chips to
a large personalization chip (or wafer) via ball-limiting metallurgy (BLM). The
personalization chip is a turn bonded to the ceramic module substrate with
module pins, as shown in Figs. 1A and 1B.
The large personalization chip can be fabricated using standard mask or E-
beam processes and would contain personalization metal and power-supply
distribution metal (multi-level). This personalization chip could also include off-
module drivers and receivers.
The module ceramic substrate consists of pins and only internal wiring to
connect the pin to the personalization chip edge connection.
The connection between the personalization chip and module substrate can
be accomplished by one of the four methods should in Figs. 2-5. In special
cases where low power chips need to be packaged with limited rework and repair
requirements, the approach in Fig. 6 could be used.
Fig. 7 illustrates the application to higher density packages.
The package is repairable and reworkable whereby:
a) LSI chips can be removed and replaced individually,
b) wire deletes can be accomplished using laser cuts,
c) if EC (engineering change) pads are available around each
circuit chip on th...