Browse Prior Art Database

Flip Chip on Personalization Chip Carrier Package

IP.com Disclosure Number: IPCOM000056409D
Original Publication Date: 1980-Dec-01
Included in the Prior Art Database: 2005-Feb-14

Publishing Venue

IBM

Related People

Authors:
Motika, F [+details]

Abstract

Described here in packaging of multichip modules (MCMS) without the need of multilayer ceramic (MLC) technology.