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Transport Mechanism for Auto Control of Sequential Dipping Operation Disclosure Number: IPCOM000056418D
Original Publication Date: 1980-Dec-01
Included in the Prior Art Database: 2005-Feb-14

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Hansen, HE Poloncic, SJ Torino, AC [+details]


A wafer transport mechanism is shown for use in semiconductor manufacturing lines. The transport mechanism and the unassociated gripper assembly (as described in the IBM Technical Disclosure Bulletin 22, 120-121 (June 1979)) and noted as gripper assembly 50 in Fig. 2 (herein) provide the means to pick up wafers from an orientor unit and precisely position the wafers in the respective processing tanks. Repetitive lateral positioning of wafers is required in major processing tanks for the proper function of any process end-point detection system. All functions in the wet process tool are presumed to be performed in an automatic mode under computer control.