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Inspection of Conductive Pattern Heights

IP.com Disclosure Number: IPCOM000056444D
Original Publication Date: 1980-Dec-01
Included in the Prior Art Database: 2005-Feb-14

Publishing Venue

IBM

Related People

Authors:
Kulcke, W [+details]

Abstract

Components and chips, for example, on printed boards, modules and other parts are interconnected by conductors produced by means of additive or subtractive processes. Circuit miniaturization increases the densities of such conductive patterns and simultaneously decreases the conductor width. The height of a conductor generally corresponds to its width, so that the conductivity obtained is theoretically satisfactory.