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Maskless Photoresist Exposure Using Electromagnetic Field

IP.com Disclosure Number: IPCOM000056466D
Original Publication Date: 1980-Dec-01
Included in the Prior Art Database: 2005-Feb-14

Publishing Venue

IBM

Related People

Authors:
Dackson, WA Finch, WF [+details]

Abstract

This article describes a method for maskless exposure of positive photoresists over metal patterns in multilayer ceramic (or other) substrates. Using this method the photoresist, upon development, washing, etc., has holes only over the metal, allowing deposition of Cr, Cu onto the metal by evaporation. The Cr, Cu (or other metal structure) bonds to the Mo substrate metal and is lifted off the insulating structures.