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Heat Sink Disclosure Number: IPCOM000056471D
Original Publication Date: 1980-Dec-01
Included in the Prior Art Database: 2005-Feb-14

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Gupta, OR Hwang, UP Simons, RE [+details]


An improved heat sink 10 is provided for removal of heat from chips 12 when the sink is immersed in a low-boiling-point dielectric liquid 14, as shown in Fig. 1. The heat sink 10 has a slot 16 running through the center thereof which is oriented within the liquid in a vertical position, as shown in Fig. 3. The heat generated in the chip 12 is transferred to the fluid 14 via the heat sink 10 when the heat load at the chip is sufficiently high to cause boiling at the surfaces exposed to the fluid.