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Stressable Resists Disclosure Number: IPCOM000056510D
Original Publication Date: 1980-Dec-01
Included in the Prior Art Database: 2005-Feb-14

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Chaudhari, P Laibowitz, RB Viggiano, JM [+details]


A severe problem in the deposition of certain metals onto resist materials (e.g., photo or electron resist) is the high stress levels in the as deposited metal film. These stresses are easily capable of pulling the resist off from the substrate during the metal deposition. Such a problem can be encountered during a lift-off process and generally ruins the entire fabrication run. Nb, Mo and many other refractory metals have this problem, which can prevent their use or, at least, severely limit their usable thickness. The inventors have many dramatic examples, as shown by SEM photographs of this delamination effect. It is also shown schematically in Fig. 1.