Browse Prior Art Database

Thermal Grease Dispensing Tool

IP.com Disclosure Number: IPCOM000056624D
Original Publication Date: 1988-Jan-01
Included in the Prior Art Database: 2005-Feb-14

Publishing Venue

IBM

Related People

Authors:
Oktay, S Olsen, K Ostergren, C [+details]

Abstract

A tool has been developed for dispensing thermal grease into semiconductor devices. It is a multi-port injector which fills cavities with thermal paste after they have been evacuated in a vacuum chamber. The tool consists of a distribution manifold with ports at the bottom which fit into the cavities in thermal module such as the thermal conduction disk (TCD) hat. The two parts are clamped together prior to injection of grease. Deaired grease is pumped into the distribution manifold through a port in the distribution manifold shown in the figure. The entire assembly is evacuated by a vacuum pump prior to grease distribution. The cavities then fill with grease without trapping any air at their bottoms. This is accomplished through a judiciously designed vent-hole.