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Enhanced Cooling of Components Mounted on Covered Circuit Cards

IP.com Disclosure Number: IPCOM000056642D
Original Publication Date: 1988-Jan-01
Included in the Prior Art Database: 2005-Feb-14

Publishing Venue

IBM

Related People

Authors:
Buller, L Linam, S [+details]

Abstract

A device for effectively cooling components mounted on covered circuit cards is disclosed. Card covers present a cooling problem because they restrict the airflow across the modules on the card. This is a problem in through-pin modules and surface mounted modules as shown in Figs. 1a and 1b. The card covers 10 are highly resistive to airflow, so most of the air flows around the card covers rather than through the card covers and over the modules, as shown in Fig. 2. Since there is no effective heat conduction path from the modules to the card covers, any airflow over the card covers, rather than the cards, does not contribute to cooling the modules. The device to improve the cooling characteristics of covered cards is a metal cylinder which creates a conduction path between the modules and the card cover.