Browse Prior Art Database

Heatsink Design for Impingement Cooling Approaches Disclosure Number: IPCOM000056695D
Original Publication Date: 1988-Jan-01
Included in the Prior Art Database: 2005-Feb-14

Publishing Venue


Related People

Kando, L Landstein, L [+details]


Cooling of semiconductor modules is essential to their proper operation. Heatsinks are used to transfer heat from the cap of a module to the ambient air. This article proposes a radial pattern for the fins in the heatsink to improve the airflow and enhance the performance of the heatsink. A conventional aluminum heatsink for a semiconductor device is shown in Fig. 1. The chip module 6 is mounted on a substrate 5 with a ceramic cap 4 covering the module. Incoming air 1 is directed downward in a vertical flow into the heatsink and exits horizontally 2 around its periphery. This approach provides high turbulence within the heatsink and non-uniform flow of the air. This article proposes a radial placement of the fins 7 (Fig. 2) which provides smoother air flow passages 1.