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Heatsink Design for Impingement Cooling Approaches

IP.com Disclosure Number: IPCOM000056695D
Original Publication Date: 1988-Jan-01
Included in the Prior Art Database: 2005-Feb-14

Publishing Venue

IBM

Related People

Authors:
Kando, L Landstein, L [+details]

Abstract

Cooling of semiconductor modules is essential to their proper operation. Heatsinks are used to transfer heat from the cap of a module to the ambient air. This article proposes a radial pattern for the fins in the heatsink to improve the airflow and enhance the performance of the heatsink. A conventional aluminum heatsink for a semiconductor device is shown in Fig. 1. The chip module 6 is mounted on a substrate 5 with a ceramic cap 4 covering the module. Incoming air 1 is directed downward in a vertical flow into the heatsink and exits horizontally 2 around its periphery. This approach provides high turbulence within the heatsink and non-uniform flow of the air. This article proposes a radial placement of the fins 7 (Fig. 2) which provides smoother air flow passages 1.