Means for Controlling Radio Frequency Sputtering Potentials
Original Publication Date: 1988-Jan-01
Included in the Prior Art Database: 2005-Feb-14
A plasma confinement cage is used to control electrode area and thus control resultant average relative potential of the electrodes. By this means, a sputtering system or system type may be employed for more than a single purpose or a system may be readily optimized for any purpose, e.g. etching, deposition, or cleaning. Referring to the figure, a cage 2 is added in place of the usual grounded electrode (usually various system parts, e.g. base plate, etc.) of a radio frequency (RF) sputtering system comprised of RF generator 4, capacitor 6 and high voltage electrode 8. Electrode 8 and cage 2 are internal to a vacuum system in which an environment of a low pressure gas is controlled.