Browse Prior Art Database

Alterable Interposer Block for Personalizing Stacked Module Interconnections

IP.com Disclosure Number: IPCOM000056715D
Original Publication Date: 1988-Jan-01
Included in the Prior Art Database: 2005-Feb-14

Publishing Venue

IBM

Related People

Authors:
Phelps, DW Redmond, RJ Ward, WC [+details]

Abstract

Plastic package construction is used to make a connection block to be interposed between two "J-connector" packaged circuit modules, thus enabling stacked circuit module mounting. By means of removing some interposer connection clips and applying staple jumpers, connections from a lower module in a stack to an upper module are personalized in module assembly. Fig. 1 is an exploded view of an assembly comprised of a lower device module 2, a personalized interposer block 4, and a top device module 6. Fig. 2 shows the assembly of connector clips 8 still attached to selvage strips 10. Eventual plastic encasement is indicated by dashed outline 12. Personalization is performed after plastic encasement and following removal of breakaway selvage strips 10. To create the personalization shown in interposer 4 of Fig.