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Increased Area for Array Chips Disclosure Number: IPCOM000056808D
Original Publication Date: 1988-Feb-01
Included in the Prior Art Database: 2005-Feb-14

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Rose, J [+details]


A proposal suggests expanding the usable chip area on thermal conduction module (TCM) semiconductor devices. The increased area would then make it possible to easily accommodate the required capacitors on the TCM. (Image Omitted) Speed and noise considerations necessitate the use of integrated capacitors on TCMs. The capacitors plus the space required to place, remove, test and rework the capacitors, chips and substrates effectively reduces the usable are of the TCM. The top view of a substrate is indicated in Fig. 1. A specific clearance required between the chip 1 and the capacitor 2 affects the available area. An individual chip site is depicted in Fig. 2. Using conventional methods, the maximum chip area 3 (Fig. 2) of the site is the shaded rectangle as shown.