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Patternable, Disposable RIE Barrier for Polyimide/Polyimide Interfaces

IP.com Disclosure Number: IPCOM000056823D
Original Publication Date: 1988-Feb-01
Included in the Prior Art Database: 2005-Feb-14

Publishing Venue

IBM

Related People

Authors:
Narayan, C Saenger, KL [+details]

Abstract

The use of an inorganic dopant in a photoresist or photo-sensitive binder is provided in a process for producing thin film wiring on a substrate. The inorganic dopant acts dually as a disposable O2 reactive ion etch (RIE) stop and as a means for removing an RIE residue layer. The dual functioning of a photoresist or photo-sensitive binder having an inorganic dopant may be seen by reference to Figs. 1a - 1f. In Fig. 1a, a starting structure having a substrate 10, a copper stud or pad 15 and a permanent polyimide layer 20 is seen. In Fig. 1b, a thin film 25 of a photoresist or photo-sensitive binder containing an inorganic dopant is applied. Thin film 25 might be a AgNO3-doped photoresist, or a suspension of other metal salts, organo-metallics, or silicates in a photoresist or photo-sensitive binder. (Image Omitted) At Fig.