Browse Prior Art Database

PROCESS for MAKING a SELF-ALIGNED REMOVABLE VLSI CONNECTOR

IP.com Disclosure Number: IPCOM000056964D
Original Publication Date: 1988-Feb-01
Included in the Prior Art Database: 2005-Feb-14

Publishing Venue

IBM

Related People

Authors:
Briska, M Faix, W Horbach, HG Lehmann, J Mueller, K [+details]

Abstract

A process is described for making a self-aligned removable microconnector which consists of a plastic foil comprising substantially perpendicularly arranged metal-filled capillaries with only few branches. Such capillaries exist, for instance, in molecular screen membranes and special foamed plastics. According to a preferred embodiment, an about 50 mm thick polyimide foil is bombarded with high-energy lead ions (E = 20 MeV). A dose of 1 x 107 atoms/cm2 produces in the foil latent tracks which are selectively etched in an alkaline solution, such as NH3/H2O. The resultant capillaries have a diameter of about 1 - 2 mm. The walls of the capillaries are activated with a Pd/Sn solution and subsequently respectively nickel-plated, using an acid Ni hypophosphite solution, and filled with nickel.