Browse Prior Art Database

Chip Cooling Device

IP.com Disclosure Number: IPCOM000057000D
Original Publication Date: 1988-Feb-01
Included in the Prior Art Database: 2005-Feb-14

Publishing Venue

IBM

Related People

Authors:
Ruppert, W Schmidt, M [+details]

Abstract

This miniature cooling device is used as a heat bridge between the chip and the external cooling means. The cooling medium is pumped through a thin cooling plate between chip and substrate. This allows the removal of heat close to the semiconductor device layer, i.e., the bottom side of the chip. Two communicating pump chambers are reciprocally compressed by piezoelectric pressure for feeding the cooling medium through the cooling plate. The device cools chips having their pads fixed face down to the substrate. Fig. 1 shows how the cooling device is integrated in the package. The basic concept is to remove heat close to the semiconductor device layer, i.e., the bottom side of the chip. Fig.