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Total Expose Alignment Mechanism for Imaging of Drilled Composites With External Circuitry and Solder Mask Artwork

IP.com Disclosure Number: IPCOM000057112D
Original Publication Date: 1988-Mar-01
Included in the Prior Art Database: 2005-Feb-14

Publishing Venue

IBM

Related People

Authors:
Duggan, DR Fry, BM Jensen, RW Pscheidt, E Sickler, JM Tomkow, S [+details]

Abstract

A method and tool for the elimination of hole breakout in drilled panels with precise alignment of plated through holes and interstitial vias to the artwork (glass or film image with external circuitry) is disclosed. This method also facilitates simultaneous front and back panel exposure, and employs a phototool to eliminate movable alignment (Image Omitted) incurred at external circuitize, and precisely align the glass on both sides with the panel. The method also assures a properly aligned exposure of the solder and mask material. The tool that the method employs makes adjustments in three parallel planes while allowing a variance in the relative distance between the planes. Other double- sided phototools exist, but none with the precise alignment control of this method.