Stamped Metal Foil Heat Sink for Tape Automated Bonded Devices
Original Publication Date: 1988-Mar-01
Included in the Prior Art Database: 2005-Feb-14
A device for providing omni-directional heat dissipation for semiconductors is disclosed. As semiconductor packaging becomes more dense and the amount of heat generated increases, a more effective means of dissipating the heat is required. Previous attempts to dissipate the heat included attaching a flat, metal heat dissipation device to the semiconductor to dissipate the heat by convection. This device required a directed airflow to create a convective airflow and cool the semiconductor. The circular, metal, heat sink, shown in Fig. 1, is stamped from metal foil of sufficient rigidity and heat conduction/radiation properties to meet the heat dissipation and mounting requirements of the semiconductor to which it is attached.