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Parallel Gap Micro-Weld Tip Assembly Fabrication Process

IP.com Disclosure Number: IPCOM000057178D
Original Publication Date: 1988-Mar-01
Included in the Prior Art Database: 2005-Feb-15

Publishing Venue

IBM

Related People

Authors:
Hu, D Ray, K Reeber, MD Rigby, EB [+details]

Abstract

This article describes a fabrication method to produce a precision, miniaturized, micro-weld tip assembly useful in a welding tool for the fabrication and repair of solid-state circuits. The tip assembly is constructed of two electrically conductive tip electrodes which are isolated by an insulator and bonded together to maintain the proper gap between the electrodes. In use the tip assembly is conventionally positioned over the wire and pad surface to be welded. A voltage is applied between the electrodes which causes a current to flow between them through a short segment of the wire to be bonded. The current flow produces momentary heating of the wire so that it melts and fuses to the pad surface. The tip assembly can be used in a hand operated welding tool or as part of an automated assembly system or a robotic machine.