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Alternate Sealing Approach for TCM Type Modules

IP.com Disclosure Number: IPCOM000057219D
Original Publication Date: 1988-Apr-01
Included in the Prior Art Database: 2005-Feb-15

Publishing Venue

IBM

Related People

Authors:
Landstein, L Spoto, MA [+details]

Abstract

An alternate hermetic compressed seal design for sealing the substrate and hat (aluminum) of a TCM (thermal conduction module)-type module is described. The disclosed approaches are cost effective, and reduce ceramic substrate loading. Current sealing technology for the TCM family utilizes the C-ring- type approach shown in Fig. 1. The C-ring 1 is positioned between an aluminum cap 2 and the top surface of the ceramic substrate 3. The substrate's lower side employs a cushioning material 4 between it and the base plate 5. The high contact force 7, together with the plating on the C-ring, provide a conformal interface capable of sealing the He gas-filled device. (Image Omitted) The disclosed seal design is shown in Fig. 2.