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Method of Placing or Removing Plastic Leaded Chip Carrier or Other "J" Lead Electrical Component

IP.com Disclosure Number: IPCOM000057234D
Original Publication Date: 1988-Apr-01
Included in the Prior Art Database: 2005-Feb-15

Publishing Venue

IBM

Related People

Authors:
Halter, EA [+details]

Abstract

A method of placing a Plastic Leaded Chip Carrier (PLCC) or other "J" lead electrical component using a heated metal thermode is described. In the case of the PLCC, there are four pivoting thermodes on each side of the device that run the length of the component. This concept could be used in a manual assembly or rework station, adapted to robot work station, or in a piece of hard tooling where several components are attached simultaneously. In the case of a rework station, the idea is applicable to removing a component as described below and illustrated in the figure.