Simple Device for Removing Chips From Decal
Original Publication Date: 1988-Apr-01
Included in the Prior Art Database: 2005-Feb-15
The following article relates to a device and method for removing a semiconductor chip from a relatively thin polyimide film chip carrier (known as a "PFCC" or "decal") to permit an examination of the wetting of controlled collapse chip connector (C-4) solder balls to pads of circuitry on the PFCC. The device comprises a piece of "spring metal" with tangs for engaging the chip on the PFCC. After the device is positioned to engage the chip, this entire assembly is passed through a furnace at a temperature sufficient to reflow the solder and allow the device to pull the chip off the PFCC without damaging the PFCC. As seen in Fig. 1, an isometric view of the chip puller, a piece of spring metal 1 is fashioned with tangs 2 which are spaced such that the tangs provide an opening which is smaller than the chip to be removed.