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Segmented Bus Connection and Cutter Disclosure Number: IPCOM000057350D
Original Publication Date: 1988-Apr-01
Included in the Prior Art Database: 2005-Feb-15

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Hoffman, PR Moskowitz, PA Tsou, UPE [+details]


Electroplating of lead patterns formed on a substrate require common electrical connection to a bus line for application of a potential during electroplating. To electrically test individual leads, the bus line connections are severed. By confining perforations in the supporting substrate to the region of severance, substrate weakening is minimized. A structurally stable substrate is required for effective handling and testing of the substrate mounted leads. (Image Omitted) Fig. 1 shows an example of an application of this concept to one lead pattern of a spaced series of patterns mounted onto a flexible substrate for electrical connection to semiconductor chips.