Browse Prior Art Database

Silicon Thermal Printer Process

IP.com Disclosure Number: IPCOM000057357D
Original Publication Date: 1988-Apr-01
Included in the Prior Art Database: 2005-Feb-15

Publishing Venue

IBM

Related People

Authors:
Cade, PE Petersen, KE [+details]

Abstract

A process is reported for fabricating high resolution and high performance thermal print head elements, their associated current driver relays and novel recessed bonding pads in single crystal silicon. (Image Omitted) Silicon technology is refined to the point where miniaturization, high resolution, reliability and high performance with very little power expended makes possible the fabrication of integrated micromechanical, thermal and electronic circuits elements in silicon utilizing current integrated circuit processing tools. A thermal print head, its associated micromechanical relay and recessed bonding pad are fabricated simultaneously in a single crystal silicon wafer. Oxide grown during processing provides both electrical and thermal isolation between the resistive element in the print head and substrate.