Browse Prior Art Database

Serial-In-Line Package SOCKET

IP.com Disclosure Number: IPCOM000057398D
Original Publication Date: 1988-May-01
Included in the Prior Art Database: 2005-Feb-15

Publishing Venue

IBM

Related People

Authors:
McLean, DC [+details]

Abstract

A socket designed to hold a Serial In-Line Package (SIP) board is shown in Figs. 1-4. A SIP board is to package as many modules as possible on a given area. There are other SIP sockets in existence today, but none have electrically separate rows of tabs. Electrically separate rows allow the socket to use both sides of the SIP board for I/Os. The sockets available now have both sides electrically the same due to the pin design and the way the board is held in the socket. With the standard SIP socket of 4.4 inches, 68 I/Os are possible. With the new design, 136 I/Os are possible in a socket only 4 inches in length. The number and type of memory modules require approximately 95 I/Os for the VRAM and 50 I/Os for the DRAM. There is no socket today to support a SIP board with 95 I/Os, such a socket would be 5.8 inches in length.