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Filled Silicone Gel As a Thermal Transfer Medium in Electronic Packages

IP.com Disclosure Number: IPCOM000057450D
Original Publication Date: 1988-May-01
Included in the Prior Art Database: 2005-Feb-15

Publishing Venue

IBM

Related People

Authors:
Akiki, GM Leach, AR Smith, RM [+details]

Abstract

A silicone gel filled with a thermally conductive powder is disclosed which is useful as a thermal transfer medium in semiconductor packages. Electronic devices in need of cooling often use a thermal transfer medium in direct contact with the device and a thermal mass to facilitate heat transfer. Present materials include a thermal grease which is extremely stiff, causing reliability problems for the device. By utilizing a silicone gel filled with any thermally conductive powder, such as boron nitride, zinc oxide, etc., and placed in contact with an electronic device, greater heat transfer is facilitated than other thermal transfer media currently in use.