Intrinsically Personalizable Edge Connector
Original Publication Date: 1988-May-01
Included in the Prior Art Database: 2005-Feb-15
A personalizable semiconductor substrate pinning technique for edge- connected modules is shown. The techniques embodied are also applicable to printed circuit cards. A pinning technique is utilized for edge-connected modules which lends itself to continuous automated handling in the personalization of connectors, assembly and metallurgical joining of the connectors to a substrate. Also, engineering change flexibility at the substrate or (Image Omitted) card level is afforded through the use of personalizable interconnections. Also, chip isolation on multi-chip substrates facilitates rapid identification and replacement of defective chips during the build and test phase of a product program. Limited substrate wiring and I/O pattern changes can be accommodated by laser customizing jumpers and busses featured by this connector.