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Apparatus to Form Bends in the Pins of a Substrate

IP.com Disclosure Number: IPCOM000057463D
Original Publication Date: 1988-May-01
Included in the Prior Art Database: 2005-Feb-15

Publishing Venue

IBM

Related People

Authors:
Simpson, JP Yurko, MJ [+details]

Abstract

In order to obtain the required compliance when attaching ceramic substrates to organic cards by surface soldering, all of the pins must be bent in a predetermined manner. Since there are literally hundreds of these pins, to make a similar bend in each pin simultaneously is the object of the apparatus to be described. (Image Omitted) Fig. 1 shows the general layout of the principal component parts of the apparatus. A substrate 10 is supported, as shown, by a head assembly 11 consisting of two parts, 12 and 13. Part 12 is pivotable relative to part 13 so that the pins 14 can be fitted through holes in puller plates 15 and 16, and so that the ends of the pins 14 can be fitted into matching holes in a bottom die 17.