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Burn-In of Integrated Circuits at Wafer Level by Light-Switching Drivers

IP.com Disclosure Number: IPCOM000057502D
Original Publication Date: 1988-May-01
Included in the Prior Art Database: 2005-Feb-15

Publishing Venue

IBM

Related People

Authors:
Iguchi, Y Saga, H [+details]

Abstract

Light-switching drivers provided at the kerf area of a wafer are used to apply burn-in signals to input pads of IC (integrated circuit) devices or chips on the wafer. This enables the burn-in of IC devices to be easily performed at a wafer level. The figure shows the present technique. Light-switching drivers 30 are built in the kerf area of wafer 10 between IC devices 20. Predetermined light patterns are sequentially input to the drivers 30 from a light source. The drivers 30 are responsive to the light patterns to apply corresponding burn-in signal patterns to input pads 40 of the IC devices 20.