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Driver Assembly Leak and Capacitance Tester

IP.com Disclosure Number: IPCOM000057517D
Original Publication Date: 1988-May-01
Included in the Prior Art Database: 2005-Feb-15

Publishing Venue

IBM

Related People

Authors:
Donald, GW Paul, RJ Seing, HS Shumate, JR Smith, RE Trollinger, RL [+details]

Abstract

This article describes a method and tooling arrangement to test for leaks in a four-color print head driver assembly prior to welding and testing piezoelectric ceramic (PEC) tube voltages and capacitance levels. Fig. 1A is an exploded perspective view of the driver assembly. Fig. 1B is an assembled view in perspective. It comprises subassemblies as follows: (Image Omitted) - PEC Gasket - Plate Assembly - PEC Set - Vent Tubes - Printed Circuit (PC) Card Assembly - Bundle Block Assembly The driver assembly is the main driving mechanism in the print head. The ink dots are fired from the head nozzle by applying appropriate voltages and frequencies to the PEC tubes via the PC card assembly.