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Radial Pin Head Design for Pin Soldering

IP.com Disclosure Number: IPCOM000057538D
Original Publication Date: 1988-May-01
Included in the Prior Art Database: 2005-Feb-15

Publishing Venue

IBM

Related People

Authors:
Ghosal, B Miller, WR Ozmat, B [+details]

Abstract

It is proposed to use a radial shape for the pin head used in making I/O connections in semiconductor devices. The shank 1 (Fig. 1) of the pin would terminate in a head 2 with a radial configuration 3 facing the I/O pad 4 to which it would be connected with solder 5. The critical area 6 of the soldered joint is along the edge of the pin head. Cracks in the ceramic or delamination of the pad begins at that point during pin pull. The new pin design increases the volume of solder at the critical point. Generated stresses may be relieved by the plastic deformation of the increased volume of the solder, leading to fewer failures of the shank or less likelihood of delamination of the ceramic. (Image Omitted) An alternative design is shown in Fig. 2 with a semi-radial shape 7 of the pin head.